Abstract: With the rapid increase of data generated by remote sensing satellites, the demand of real-time demodulation of ultrahigh speed remote sensing data by digital receivers has become a research ...
The AI-driven platform establishes the foundation for enterprises to move beyond dashboards and static reporting toward dynamic, autonomous, and embeddable AI-native data products that can reason, act ...
Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...
Can You Chip In? We’re celebrating our 1 trillionth archived web page. If you find our library useful, learn how you can help us fundraise! Can You Chip In? We’re celebrating our 1 trillionth archived ...
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