In PCB design, design for manufacturing (DfM) is all about correcting mistakes after reviewing a PCB layout. We then devise corrective actions to fix those mistakes and improve procedures to make ...
Abstract: Solder joint voids are usually formed by the entrapped gas bubbles during the reflow process and are common in all surface mount applications. It is a controversial issue on the reliability ...
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of insulated, surface-mount inrush current limiting ...
Oklahoma City voters are going to the polls today to decide the status of a historic $2.718 billion bond. If all categories receive a majority approval rating from the voters, it would set funds aside ...
Late South African ambassador to France Nathi Mthethwa's son, Mkhululi, delivers a tribute during his funeral on 12 October 2025. Picture: Katlego Jiyane/EWN KWAMBONAMBI - The children of the late ...
Due to the lapse in federal government funding, NASA is not updating this website. NASA's Science Mission Directorate (SMD) announces the release of its annual omnibus solicitation for basic and ...
Abstract: In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder ...
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