IEEE

Silicon-based package level liquid cooling module for system on wafer (SoW)

Abstract: As the development speed of Moore's Law slows down, advanced packaging has emerged as a pivotal approach to enhancing chip performance, yet the accompanying thermal management challenges ...
IEEE

An Effective EMI/SI Co-analysis and Co-design Method for Pin Map of System-in-Package

Abstract: This paper proposes an integrated approach combining the T-matrix equation and a non-dominated sorting genetic algorithm (NSGA) to co-optimize electromagnetic interference (EMI) and signal ...
The Morning Journal

Lorain Public Library System collecting ‘thank you’ letters for first responders

The collections started from Oct. 1 and will conclude Oct. 25. In honor of National First Responders Day on Oct. 28, patrons who visit any location will have the chance to submit a letter to be sent ...
Semiconductor Engineering

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)

A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, ...