In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...
The Java virtual machine provides a high-performance, universal runtime for a wealth of popular languages beyond just Java. In this article, we’ll look at the characteristic strengths and common use ...
JDK 25 brings powerful new features to Java and JVM developers. Here are seven new or updated features that could convince ...
Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...
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