In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

JDK 25 brings powerful new features to Java and JVM developers. Here are seven new or updated features that could convince ...

China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market takes off in 2026.

Apple launched a slate of new iPhones on Tuesday loaded with the company's new A19 and A19 Pro chips. Along with an ultrathin iPhone Air and other redesigns, the new phones come with a less flashy ...

“Franco: Spain’s Scorned Memory,” a new documentary that marks the 50th anniversary of the death of Spanish dictator Francisco Franco, is making its market debut at this year’s Unifrance Rendez-Vous ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. This article dives into the happens-before ...

There are two pools of memory that are available to you as a C++ programmer: the stack and the heap. Until now, we’ve been using the stack. This video (9:30) explains the difference between the stack ...