In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

Mumbai/Bengaluru: There was no high-decibel government event, or even an investor roadshow. The message was tucked inside K. Krithivasan’s prepared remarks, in a recent media release. India’s largest ...

As part of the group’s preparation for the upcoming demo, this issue focuses on defining the demo structure and user scenarios collaboratively, while taking individual responsibility for drafting and ...

The AI-driven platform establishes the foundation for enterprises to move beyond dashboards and static reporting toward dynamic, autonomous, and embeddable AI-native data products that can reason, act ...

Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...