Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: In this paper, a 3D printed slotted waveguide antenna array is proposed for millimeter-wave communication systems at 28 GHz. The design method consists of the characterization of an isolated ...
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