Department of Chemical Sciences, University of Padova, via Marzolo 1, 35131 Padova, Italy ...
Abstract: Carbon nanotube (CNT) is recently proposed as an alternative material for through-silicon via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article, by ...
Center for High-Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao, Hebei 066004, China ...
The City of Columbus is helping property owners revitalize older buildings in designated areas with a new micro-TIF program, which makes improvements easier and faster than traditional tax increment ...
Naples, Italy, has been confirmed as the host of the 38th America's Cup. A new era in the America’s Cup will be ushered in next month. A new America’s Cup governance board will take over the ...
Copyright 2025 The Associated Press. All Rights Reserved. Copyright 2025 The Associated Press. All Rights Reserved. A man scoops up portions of wheat to be allocated ...
KITTITAS COUNTY, Wash. - Kittitas Valley Fire and Rescue contained a brush fire that was threatening a structure. KVFR wrote on social media that when they arrived, they found grass, trees and other ...
Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...
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