1 School of Artificial Intelligence and Digital Economy Industry, Guangzhou Institute of Science and Technology, Guangzhou, China 2 Department of Cardiology, Second Affiliated Hospital of Nanchang ...
Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...
Abstract: Accurate geo-localization of remote sensing images without explicit geographic metadata remains a persistent challenge in the remote sensing field. Most existing approaches rely on matching ...
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