Abstract: A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection ...

Direct Dimensions, Inc., a leader in 3D scanning, modeling, and digital measurement solutions, is teaming up with CAD BLU, one of the nation's premier providers of 3D printing and additive ...

The Ioda, launched this autumn, is compact, quick to rig, and takes off in just 8 knots of breeze — making foiling more accessible than ever. With the BirdyFish French team on site and a limited ...

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Abstract: Scan-based side-channel attacks have been proven to be popular attack methods against cryptographic chips. In these attacks, attackers can use scan chains inside a chip to obtain internal ...