In PCB design, design for manufacturing (DfM) is all about correcting mistakes after reviewing a PCB layout. We then devise corrective actions to fix those mistakes and improve procedures to make ...
Recommended particle size: T6 type (5-15μm), No. 6 powder (5-15μm) or finer No. 7 powder (2-11μm). Reason: Mini LED chips are small in size and dense in pitch, so ultra-fine particle size solder paste ...
In the late 1980s and 1990s, the Game Boy redefined handheld entertainment. With its chunky buttons, monochrome screen, and ...
Abstract: Solder joint voids are usually formed by the entrapped gas bubbles during the reflow process and are common in all surface mount applications. It is a controversial issue on the reliability ...
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