What goes up must come down: The 'universal thermal performance curve' that shackles evolution

Scientists from Trinity College Dublin have unearthed a universal thermal performance curve (UTPC) that seemingly applies to ...
TMCnet

Trane Technologies Unveils Industry's First Comprehensive Thermal Management System Reference Design for Gigawatt Scale NVIDIA AI Factories

Trane Technologies (NYSE:TT), a global climate innovator, today announced the launch of the industry's first comprehensive thermal management system reference design, specifically engineered for the ...
Hosted on MSN

Geometric Future Model 5 Vent - great thermal performance

The geometric future cases that we have reviewed on the channel previously have all featured unique design elements, including rotated motherboard orientation, leather highlights, and intentionally ...
Semiconductor Engineering

Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)

Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...
IEEE

Identification of Thermal Parameters for PMSMs Based on High-Fidelity Lumped-Parameter Thermal Model

Abstract: Thermal parameters in permanent magnet synchronous machines (PMSMs) often need to be identified or calibrated due to uncertainties arising from manufacturing and assembly processes. This ...
IEEE

High-Accuracy Lumped-Parameter Thermal Modeling for Fractional-Slot Concentrated-Winding PMSMs Under Short-Circuit Fault Conditions

Abstract: This article proposes a high-accuracy lumped-parameter (LP) thermal modeling method to predict maximum winding temperatures and the asymmetric winding temperature distributions under ...