IEEE

3D-Millimeter Wave Integrated Circuit (3D-mmWIC): A Gold-Free 3D-Integration Platform for Scaled RF GaN-on-Si Dielets with Intel 16 Si CMOS

Abstract: This paper presents a gold-free 3D millimeter wave integrated circuit (3D-mmWIC). Highly scaled GaN-on-Si front-end-of-line (FEOL) RF dielets are integrated with Intel 16 Si CMOS using Cu-Cu ...
Gigwise

Designing Circuits with Parallel and Series Capacitors: A Step-by-Step Tutorial

Among the abundance of components making up electronic circuits, very few are as important as capacitors. These components, ...
IEEE

Fully Integrated GaN-on-Silicon Power-Rail ESD Clamp Circuit Without Transient Leakage Current During Normal Power-on Operation

Abstract: When more circuit functions are integrated into a single chip fabricated by the GaN-on-Silicon process, the need for on-chip electrostatic discharge (ESD) protection design becomes crucial ...