In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...
JDK 25 brings powerful new features to Java and JVM developers. Here are seven new or updated features that could convince ...
Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...
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