Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...

is a senior reporter who has covered AI, robotics, and more for eight years at The Verge. Photographs fade, books rot, and even hard drives eventually fester. When you take the long view, preserving ...

The notion of cars and trucks being built up as they snake along assembly lines may seem so 2024 in time as automakers, suppliers and an array of innovative tech companies find new ways to send ...

What do you imagine when you think about space? Probably one of the rainbow-colored photos we so often see. A field of stars and galaxies. But those pictures are missing one integral component: ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

When someone mentions "different dimensions," we tend to think of things like parallel universes – alternate realities that exist parallel to our own, but where things work or happened differently.

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