Abstract: Sparse arrays designed based on fourth-order difference co-array (DCA) can achieve significantly higher uniform degrees-of-freedom (uDOFs). However, most existing fourth-order sparse arrays ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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