India’s top three telecom operators are leveraging custom artificial intelligence (AI) algorithms, multiple datasets and outsourced security experts in a bid to take on spam callers. As remote ...
Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...
Abstract: Approximate computing has emerged as a powerful solution for error-tolerant applications where perfect accuracy is not mandatory. Among arithmetic units, parallel prefix adders (PPAs) are ...
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