The Department of Engineering at Durham University is currently undergoing a period of strategic growth and now seeks to appoint a talented individual to the role of Associate Professor in Electrical ...

Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...

DALLAS, Oct. 13, 2025 /PRNewswire/ -- Solidion Technology Inc. ("Solidion" or the "Company") (Nasdaq: STI), an advanced battery technology solutions provider, today announced the development of a next ...

Intel Corp. unveiled details Thursday about its sophisticated Panther Lake processors and Arizona’s critical role in manufacturing the company's next-generation personal computer chip technology.

Abstract: This invited paper reviews main approaches in the electrical characterization of advanced MOSFETs towards their target analog and RF applications. Advantages and necessity of those ...