(MENAFN- GlobeNewsWire - Nasdaq) Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and ...
Today’s sophisticated vehicles leverage embedded systems for everything from infotainment to powertrain management. Even low-end automobiles incorporate scores of electronic control units (ECUs). By ...
It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...
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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques
Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and ...
Greater use of ICs in consumer electronics products is pushing the demand for higher-density, lower-cost and higher-performance ICs, giving a greater push to package devices in 3D form. A never-ending ...
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