TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D WILMINGTON, Mass.--(BUSINESS WIRE)--Onto ...

Geneva (Switzerland) and Bernin (France), December 1, 2022 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec ...

Intel signs pact with Odisha & 3DGS to bring semiconductor substrate manufacturing tech to India. $3.3B investment, 1800+ jobs.

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

As the complexity of integrated circuits grows, manufacturers are increasingly turning to Advanced Intelligent Ceramic Manufacturing Solutions to meet stringent production requirements. These ...

The proposed Intel-3DGS glass substrate facility will not make chips, but it could help India secure a place in the supply ...

Under the MDA Aurora TM contract, Airbus will supply over 200 Sparkwing solar arrays, consisting of 2 wings with 5 panels each and providing a photovoltaic area of well over 30 sqm. Bercella will ...