LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global low-temperature co-fired ceramic (LTCC) substrate market is projected to grow to USD 285.13 million by ...

KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor ...

As the complexity of integrated circuits grows, manufacturers are increasingly turning to Advanced Intelligent Ceramic Manufacturing Solutions to meet stringent production requirements. These ...

This study investigates lignocellulose nanofibrils (LCNF) as a sustainable alternative material for printed circuit board (PCB) substrates, demonstrating an application through the development of an ...

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for all energy ...

Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the ...

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

Taiwan-based Leatec Fine Ceramics, a dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, is mulling raising its quotes in the wake of a recent 15% price hike ...

Japan's Kyocera will be expanding its investment in equipment and R&D for semiconductors and electronic components for the next three fiscal years (2023/4-2026/3). The total capital spending will be ...

Recent research has introduced a new approach to this problem by drawing inspiration from kirigami—the art of cutting and folding flat sheets into intricate shapes. By applying kirigami-based designs ...

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...