Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the ...
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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques
Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and ...
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