The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
No automatic method exists to insert the different and multiple RLC package/PCB models of the Chip in Mix Mode (RTL + Spice) AMS verification. Such additions of components are inserted in simulation ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
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