There are a number of complex tasks involved in the manufacturing of electronic assemblies, all of which can go wrong. In order to ensure quality standards are met, the fabrication of the printed ...

GOEPEL electronic has announced the availability of boundary-scan integration into SPEA’s multicore ICT (in-circuit-test) platform. With the level of integration provided for the SPEA 3030 ICT system, ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect ...

Researchers have developed a new graphene transistor with 1000 times higher on/off switching ratio. Researchers at the University of Southampton have developed a new graphene transistor with 1000 ...

Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint. As information and communication ...