Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

is a senior reporter who has covered AI, robotics, and more for eight years at The Verge. Photographs fade, books rot, and even hard drives eventually fester. When you take the long view, preserving ...

When someone mentions "different dimensions," we tend to think of things like parallel universes – alternate realities that exist parallel to our own, but where things work or happened differently.

The notion of cars and trucks being built up as they snake along assembly lines may seem so 2024 in time as automakers, suppliers and an array of innovative tech companies find new ways to send ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

This is an archived article and the information in the article may be outdated. Please look at the time stamp on the story to see when it was last updated. OK, so you know all about 3D movies by now.